Continuous copper plating of round steel is a special plating process in which a copper layer is deposited electrochemically and continuously on the surface of round steel. This process is particularly suitable for mass production and can guarantee the uniformity and quality of the plating layer.
Author: Anna
Continuous copper plating of round steel is a special plating process in which a copper layer is deposited electrochemically and continuously on the surface of round steel. This process is particularly suitable for mass production and can guarantee the uniformity and quality of the plating layer. The following is the general flow of the continuous copper plating process and its characteristics:
Process Flow:
Surface pretreatment:
Cleaning: Use chemical solutions or physical methods to remove grease, dust, oxidized skin and other impurities on the surface of round steel.
Pickling: the use of acidic solution to remove the round steel surface of the oxide layer and rust.
Activation: Use chemical solution to treat the surface of round steel to activate it and improve the adhesion of subsequent plating layer.
Continuous plating:
Electrolyte Configuration: Preparation of electrolyte containing copper ions, usually a mixture of copper sulfate and sulfuric acid.
Continuous passage through plating tanks: Pre-treated round steel is passed through one or more plating tanks, each containing a specific electrolyte.
Energizing: Round steel is used as the cathode and copper plate is used as the anode, and direct current is applied to reduce copper ions to a copper layer on the surface of the round steel.
Control Parameters: Precise control of parameters such as current density, electrolyte temperature, pH value, etc. to ensure the quality of the coating.
Post-treatment:
Cleaning: After plating is completed, use water or other solvents to clean the surface of round steel to remove the residual electrolyte.
Passivation: Optional step, using chemical methods to form a passivation film on the surface of the copper layer to improve corrosion resistance.
Drying: Removes moisture from the round steel surface to prevent oxidation and corrosion.
Quality Inspection:
Measure the thickness, uniformity, bonding strength and other indicators of the coating to ensure compliance with standard requirements.
Features:
Efficient production: continuous plating process is suitable for mass production with high efficiency.
Uniform plating: Very uniform plating can be obtained through the continuous process.
High quality plating: The plating is of high purity, usually 99.9% or more of electrolytic copper molecules.
Good bonding: The plating layer is tightly bonded to the substrate and is not easy to come off.
Excellent performance: Good electrical conductivity and corrosion resistance, close to that of pure copper.
Cost-effective: Compared with full copper material, copper plated round steel is less costly.
Areas of application:
Grounding systems: used as grounding devices for buildings and electrical equipment.
Power transmission: as conductors in transmission lines.
Lightning protection systems: as conductors for lightning protection and electrostatic discharges.